국내 유통 에폭시 기술자료
2012.10.02 21:27
[산업] Hysol FP5300 'Epoxy Adhesive'(Flip Chip, Flex to laminate and Flex to flex assembly)
조회 수 5483 추천 수 0 댓글 0
Arirang chemical co.
FP5300 provides the following product characteristics:
---------------------------------------------------------------------------
Technology : Epoxy
Appearance : Brown
Product Benefits : ? High purity
? Anisotropic electrically conductive
Components : One-component
Cure : Heat cure
Application : Underfill
Typical Applications : Flip Chip, Flex to laminate and Flex to flex assembly