[산업]아렘코(AREMCO) 668 세라믹 고온용 접착,보수제

by 아리랑 posted Mar 10, 2011
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아렘코(AREMCO) 668

항목

특성

제품번호(Product No.)

668

베이스(Major Constituent)

알루미나-실리카

내열도(Maximum Temperature, °F (°C))

2,500(1,371)

열전도률(CTE, in/in/°F x 10-6 (°C))

4.0(7.2)

체적저항률(Volume Resistivity, ohm-cm @ RT (@ 1000 °F)

10-8 (10-4)

절연저항(Dielectric Strength,volts per mil @ RT (@ 1000 °F)

245 (95)

토르크 강도(Torque Strength, ft-lbs?)

10.6

내습성(Moisture Resistance?)

우수

내알칼리성(Alkali Resistance?)

우수

내산성(Acid Resistance?)

좋음

핸들링

(Handling)

No. Components

1

Mix Ratio, powder:liquid

N/A

Viscosity, cP

Paste

Specific Gravity, gms/cc

2.09

경화

(Curing)

Air Set, hours

1

Heat Cure, °F, hrs

200/1-5

칼라(Color)

백색

사용기간(Shelf Life, Months)

6

저장(Storage, °F)

40-90

Reference Notes ? Graphi-Bond™ 551-RN is recommended for reducing atmospheres only. For international shipments, order two-part system, Graphi-Bond™ 551-RN-X, to extend shelf life.

? This test is performed after curing for 5 hours @ 200 °F.

? Ceramabond™ 690 operates to 1560 °F in an oxidizing atmosphere or to 2700 °F in a vacuum/inert atmosphere.

? Thermal conductivity of monolithic Aluminum Nitride is ~170 W/m-°K (1388 BTU-in/hr-ft2-°F )

? Properties after firing above 700 °F.

? A two-part variation of 835M named 835MB is also available. It is particularly good for bonding ceramics to quartz.

 


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