Hysol ECCOBOND 282 |
|
Chemical Type |
Epoxy |
Appearance |
Black |
Cure |
Heat cure |
Product Benefits |
- One component - High thermal conductivity - Silk screenable - Viscous - Fast cure - Long pot life - Good heat dissipation |
Application |
Assembly |
Operating Temperature |
-40 to 180 °C |
Typical Assembly Applications |
Heat sink bonding |
Substrates |
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