[산업] Hysol FP6101 'Unfilled Flexible Epoxy' CSP/BGA Underfill - 언더필 CSP/BGA

by 아리랑 posted Oct 02, 2012
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Arirang chemical co. /Korea

 

FP6101 provides  the following product characteristics:
Technology :  Epoxy
Appearance :  Black
Product Benefits :

 ? Reworkable
? High flow
? High adhesion to flexible and rigid substrates
? Low modulus
? Low stress
Components : One-component
Cure : Heat cure
Application :  CSP/BGA Underfill


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