[산업] Hysol FP5300 'Epoxy Adhesive'(Flip Chip, Flex to laminate and Flex to flex assembly)

Arirang chemical co.

 

FP5300 provides  the following product characteristics:

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Technology : Epoxy
Appearance : Brown
Product Benefits : ? High purity
                            ? Anisotropic electrically conductive
Components : One-component
Cure : Heat cure
Application : Underfill
Typical Applications : Flip Chip, Flex to laminate and Flex to flex assembly