Ultra High Temperature |
526N Clear-Amber, 1:1 two-part System for Tough Bonding Applications. |
570 One-part Contact Adhesive, Excellent Flexibility. |
805 Aluminum-Filled, Low Shrinkage, High Thermal Conductivity, For Bonding and Molding Applications. |
2330 One-part, Heat Curable, Silicone Elastomer Adhesive. |
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High Temperature, Special Purpose |
568 Aluminum-Filled, 1:1 two-part, Good Bond Strength and High Thermal Conductivity. |
631 Clear-Amber, 1:1 two-part, Good Bond Strength and Corrosion Resistance. |
657 Stainless Steel-Filled, 1:1 two-part, High Corrosion Resistance. |
807 10 Minute Set, Non-Sagging, 1:1 two-part, Excellent Electrical & Mechanical Properties. |
820 Clear, 1:1 two-part, 45-Minute Cure System with Good Flexibility. |
2150 Ceramic-Filled, Fast-Setting, High Vibration Resistance and Bond Strength. Ideal For Ceramic Wear Tiles. |
2315 High Temperature, Thermally Conductive, Low Viscosity, Potting Compound for Electrical Applications. |
2318 High Temperature, Low Viscosity, Room Temp Curing Potting Compound. |
High Temperature, Maintenance and Repair |
2200 Kevlar-Reinforced, Epoxy-Novolac, High Strength, Excellent Abrasion and Corrosion Resistance. |
2210 Aluminum and Ceramic-Filled, Vibration and Impact Resistant, For Aluminum Mold and Wear Surfaces. |
2220 Ceramic-Filled, High Chemical Resistance, Machinable, For Repairing Deeply-Corroded Parts. |
Ultra High Bond Strength |
2300 Milky Clear, 10:1, Low Viscosity, Exceptional Bond Strength. |
2310 Ceramic-Filled, 1:1 two-part, High Lap Shear and Peel Strength, Autoclavable. |